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Thank you for your interest in Computer Microtechnology Inc part number NS1089, a Microcircuitmemory product we carry that is featured with the NSN 5962-00-530-4660. This component is ready for purchase at any time, so you are encouraged to complete the Request for Quote (RFQ) form provided below if you would like to obtain pricing information for your consideration. All we ask is that you supply us with essential details like desired item quantities, target price, and when fulfillment is expected, as this will ensure our response caters to any distinct specifications.
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At ASAP Semiconductor, our goal is to make the process of finding and securing precise components simple, which is why we present vital listing details with each offering here on Boundless Aerospace. For instance, part number NS1089 was manufactured by Computer Microtechnology Inc under the CAGECode 12735, and with the NSN 5962-00-530-4660, it belongs to FSC 5962 Microcircuits Electronic. More than that, all our inventory is delivered with any pertinent qualifying certifications or manufacturer trace documentation for your further benefit. Bearing all of this in mind, be sure to request a quote for part number NS1089 today, and we will be in touch as soon as possible.
NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
---|---|---|---|---|---|---|
5962-00-530-4660 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 005304660 | 0 | N | B | |
CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
U | B | A | 0 | |||
Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
310117P1 | 1 | 2 | 3 |
MRC | Criteria | Characteristic |
---|---|---|
ADAQ | BODY LENGTH | 0.735 INCHES MINIMUM AND 0.830 INCHES MAXIMUM |
ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.295 INCHES MAXIMUM |
ADAU | BODY HEIGHT | 0.055 INCHES MINIMUM AND 0.125 INCHES MAXIMUM |
AEHX | MAXIMUM POWER DISSIPATION RATING | 700.0 MILLIWATTS |
AFGA | OPERATING TEMP RANGE | -55.0 TO 85.0 DEG CELSIUS |
AFJQ | STORAGE TEMP RANGE | -62.0 TO 125.0 DEG CELSIUS |
CBBL | FEATURES PROVIDED | MONOLITHIC AND HERMETICALLY SEALED AND LOW POWER AND 3-STATE OUTPUT AND POSITIVE OUTPUTS |
CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
CQSZ | INCLOSURE CONFIGURATION | DUAL-IN-LINE |
CQWX | OUTPUT LOGIC FORM | P-TYPE METAL OXIDE-SEMICONDUCTOR LOGIC |
CQZP | INPUT CIRCUIT PATTERN | 11 INPUT |
CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | 20.0 VOLTS MAXIMUM POWER SOURCE |
CZER | MEMORY DEVICE TYPE | ROM |
CZZZ | MEMORY CAPACITY | UNKNOWN |
TEST | TEST DATA DOCUMENT | 94117-310117 SPECIFICATION (INCLUDES ENGINEERING TYPE BULLETINS,BROCHURES,ETC.,THAT REFLECT SPECIFICATION TYPE DATA IN SPECIFICATION FORMAT; EXCLUDES COMMERCIAL CATALOGS,INDUSTRY DIRECTORIES,AND SIMILAR TRADE PUBLICATIONS,REFLECTING GE |
TTQY | TERMINAL TYPE AND QUANTITY | 16 PRINTED CIRCUIT |
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