Thank you for your interest in Dla Land And Maritime part number DMS 85085B, a Microcircuit Memory product we carry that is featured with the NSN 5962-00-739-5274. This component is ready for purchase at any time, so you are encouraged to complete the Request for Quote (RFQ) form provided below if you would like to obtain pricing information for your consideration. All we ask is that you supply us with essential details like desired item quantities, target price, and when fulfillment is expected, as this will ensure our response caters to any distinct specifications.
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At ASAP Semiconductor, our goal is to make the process of finding and securing precise components simple, which is why we present vital listing details with each offering here on Boundless Aerospace. For instance, part number DMS 85085B was manufactured by Dla Land And Maritime under the CAGECode 16236, and with the NSN 5962-00-739-5274, it belongs to FSC 5962 Microcircuits Electronic. More than that, all our inventory is delivered with any pertinent qualifying certifications or manufacturer trace documentation for your further benefit. Bearing all of this in mind, be sure to request a quote for part number DMS 85085B today, and we will be in touch as soon as possible.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-00-739-5274 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 007395274 | N | B | ||
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| B | U | |||||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 6088465-9 | 2 | 2 | 3 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ADAU | BODY HEIGHT | 0.052 INCHES MINIMUM AND 0.062 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 625.0 MILLIWATTS |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | HERMETICALLY SEALED AND MONOLITHIC AND POSITIVE OUTPUTS AND W/ENABLE AND PROGRAMMABLE AND PROGRAMMED AND W/DECODED OUTPUT |
| CQSJ | INCLOSURE MATERIAL | CERAMIC AND GLASS |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | TRANSISTOR-TRANSISTOR LOGIC |
| CQZP | INPUT CIRCUIT PATTERN | 18 INPUT |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -1.5 VOLTS MINIMUM POWER SOURCE AND 5.5 VOLTS MAXIMUM POWER SOURCE |
| CZEQ | TIME RATING PER CHACTERISTIC | 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 60.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
| CZER | MEMORY DEVICE TYPE | ROM |
| CZZZ | MEMORY CAPACITY | UNKNOWN |
| ADAQ | BODY LENGTH | 0.770 INCHES MINIMUM AND 0.790 INCHES MAXIMUM |
| ADAT | BODY WIDTH | 0.375 INCHES MINIMUM AND 0.385 INCHES MAXIMUM |
| TEST | TEST DATA DOCUMENT | 06840-6088465 DRAWING (THIS IS THE BASIC GOVERNING DRAWING,SUCH AS A CONTRACTOR DRAWING,ORIGINAL EQUIPMENT MANUFACTURER DRAWING,ETC.; EXCLUDES ANY SPECIFICATION,STANDARD OR OTHER DOCUMENT THAT MAY BE REFERENCED IN A BASIC GOVERNING DRAW |
| TTQY | TERMINAL TYPE AND QUANTITY | 28 FLAT LEADS |
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