Thank you for your interest in L 3 Communications Corporation part number 7186674 002, a Shielding Bead Electronic product we carry that is featured with the NSN 5950-01-578-9923. This component is ready for purchase at any time, so you are encouraged to complete the Request for Quote (RFQ) form provided below if you would like to obtain pricing information for your consideration. All we ask is that you supply us with essential details like desired item quantities, target price, and when fulfillment is expected, as this will ensure our response caters to any distinct specifications.
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At ASAP Semiconductor, our goal is to make the process of finding and securing precise components simple, which is why we present vital listing details with each offering here on Boundless Aerospace. For instance, part number 7186674 002 was manufactured by L 3 Communications Corporation under the CAGECode 06401, and with the NSN 5950-01-578-9923, it belongs to FSC 5950 Coils and Transformers. More than that, all our inventory is delivered with any pertinent qualifying certifications or manufacturer trace documentation for your further benefit. Bearing all of this in mind, be sure to request a quote for part number 7186674 002 today, and we will be in touch as soon as possible.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5950-01-578-9923 Item PartTypeName: SHIELDING BEAD,ELECTRONIC | 5950 | 015789923 | 0 | P | A | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | A | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| 7186674-002 | 5 | 2 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| MRC | Decoded Requirement | Clear Text Reply |
| FEAT | Special Features | CHIP BEAD (IMPEDER), MMZ SERIES OFFERS 4 CONSTRUCTION MATERIALS; SIZE STANDARIZED FOR USE BY AUTOMATIC ASSEMBLY EQUIPMENT; NO PREFERRED ORIENTATION; EITHER FLOW OR REFLOW SOLDERING METHODS CAN BE USED DUE TO ELECTROPLATING OF THE TERMINAL ELECTRODES; HIGH RELIABILITY DUE TO AN ENTIRELY MONOLITHIC STRUCTURE; CLOSED MAGNETIC CIRCUIT STRUCTURE ALLOWS HIGH-DENSITY INSTALLATION WHILE PREVENTING CROSSTALK BETWEEN CIRCUITS; LOW DC RESISTANCE STRUCTURE OF ELECTRODE PREVENTS WASTEFUL ELECTRIC POWER CONSUMPTION; CONTAINS NO LEAD AND ALSO SUPPORT LEAD-FREE SOLDERING; CONFORMING TO ROHS DIRECTIVE |
| CXCY | Part Name Assigned By Controlling Agency | CHIP BEADS(SMD) FOR SIGNAL LINE |
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