Thank you for your interest in Texas Instruments Inc part number TIBPAL16R8-30MWB, a Microcircuit Memory product we carry that is featured with the NSN 5962-01-332-5751. This component is ready for purchase at any time, so you are encouraged to complete the Request for Quote (RFQ) form provided below if you would like to obtain pricing information for your consideration. All we ask is that you supply us with essential details like desired item quantities, target price, and when fulfillment is expected, as this will ensure our response caters to any distinct specifications.
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At ASAP Semiconductor, our goal is to make the process of finding and securing precise components simple, which is why we present vital listing details with each offering here on Boundless Aerospace. For instance, part number TIBPAL16R8-30MWB was manufactured by Texas Instruments Inc under the CAGECode 01295, and with the NSN 5962-01-332-5751, it belongs to FSC 5962 Microcircuits Electronic. More than that, all our inventory is delivered with any pertinent qualifying certifications or manufacturer trace documentation for your further benefit. Bearing all of this in mind, be sure to request a quote for part number TIBPAL16R8-30MWB today, and we will be in touch as soon as possible.
| NSN | FSC | NIIN | CLS | Hazmat | DEMIL | Cancelled NSN |
|---|---|---|---|---|---|---|
| 5962-01-332-5751 Item PartTypeName: MICROCIRCUIT,MEMORY | 5962 | 013325751 | 0 | N | D | |
| CIIC | HCC | ESD | PMIC | Criticality | ENAC | |
| U | D | A | 0 | |||
| Part Number | ISC | RNVC | RNCC | HCC | MSDS | SADC |
| PAL16R8B-2MW/883B | 5 | 9 | 5 |
| MRC | Criteria | Characteristic |
|---|---|---|
| ABMK | OVERALL WIDTH | 0.745 INCHES MINIMUM AND 1.040 INCHES MAXIMUM |
| AEHX | MAXIMUM POWER DISSIPATION RATING | 0.6 WATTS |
| CQSJ | INCLOSURE MATERIAL | CERAMIC |
| CWSG | TERMINAL SURFACE TREATMENT | SOLDER |
| ADAQ | BODY LENGTH | 0.540 INCHES MAXIMUM |
| ADAU | BODY HEIGHT | 0.045 INCHES MINIMUM AND 0.100 INCHES MAXIMUM |
| AFGA | OPERATING TEMP RANGE | -55.0/125.0 DEG CELSIUS |
| CBBL | FEATURES PROVIDED | BIPOLAR AND MONOLITHIC AND PROGRAMMABLE AND W/CLOCK AND 3-STATE OUTPUT AND W/ENABLE |
| CQSZ | INCLOSURE CONFIGURATION | FLAT PACK |
| CQWX | OUTPUT LOGIC FORM | BIPOLAR METAL-OXIDE SEMICONDUCTOR |
| CQZP | INPUT CIRCUIT PATTERN | 16 INPUT |
| CTFT | CASE OUTLINE SOURCE AND DESIGNATOR | F-9 MIL-M-38510 |
| CTQX | CURRENT RATING PER CHARACTERISTIC | 12.00 MILLIAMPERES AVERAGE FORWARD CURRENT AVERAGED OVER A FULL 60-HZ CYCLE NOT APPLICABLE |
| CZEN | VOLTAGE RATING AND TYPE PER CHARACTERISTIC | -0.5 VOLTS MAXIMUM POWER SOURCE AND 7.0 VOLTS MAXIMUM POWER SOURCE |
| CZER | MEMORY DEVICE TYPE | PAL |
| TEST | TEST DATA DOCUMENT | 96906-MIL-STD-883 STANDARD (INCLUDES INDUSTRY OR ASSOCIATION STANDARDS,INDIVIDUAL MANUFACTUREER STANDARDS,ETC.). |
| TTQY | TERMINAL TYPE AND QUANTITY | 20 FLAT LEADS |
| ADAT | BODY WIDTH | 0.245 INCHES MINIMUM AND 0.300 INCHES MAXIMUM |
| AFJQ | STORAGE TEMP RANGE | -65.0/150.0 DEG CELSIUS |
| CZEQ | TIME RATING PER CHACTERISTIC | 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,LOW TO HIGH LEVEL OUTPUT AND 20.00 NANOSECONDS MAXIMUM PROPAGATION DELAY TIME,HIGH TO LOW LEVEL OUTPUT |
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